Call for Papers

IEEE TENSYMP 2027 invites full paper submissions (maximum 6 pages) presenting original research, innovative applications, and case studies aligned with the symposium theme.

Overview

We invite researchers, academics, and industry professionals to submit their original work across a wide range of topics. Accepted and presented papers will be submitted to IEEE Xplore subject to IEEE quality standards. The symposium covers 8 major tracks spanning AI, communications, IoT, energy, cybersecurity, healthcare, ethics, and education.

Full papers (4–6 pages, IEEE double-column format) are invited. Submissions should present original research contributions, innovative applications, or case studies aligned with the symposium theme — Connected Intelligence for Resilient Societies.


Call for Papers – Tracks

  1. Artificial Intelligence, ML, and Data Intelligence
    • AI for social good, resilient systems, predictive analytics, and intelligent decision-making.
  2. Future Communication and Networking Technologies
    • 5G/6G networks, IoT infrastructure, sensor platforms, and secure communication systems.
  3. Cyber-Physical Systems, IoT, and Intelligent Automation
    • Smart sensing, real-time control, robotics, and integrated adaptive systems.
  4. Sustainable Energy and Environmental Technologies
    • Renewable energy, smart grids, environmental monitoring, and climate-resilient designs.
  5. Cybersecurity, Privacy, and Resilient Computing
    • Secure architectures, privacy-preserving systems, and fault-tolerant computing.
  6. Technology for Health, Humanity, and Society
    • AI in healthcare, telemedicine, ICT for communities, and socially impactful innovations.
  7. Ethics, Policy, and Governance in Connected Systems
    • Responsible AI, governance frameworks, standards, and ethical challenges.
  8. Education and Capacity Building in Resilient Technologies
    • Digital literacy, workforce development, and engineering education for future technologies.

Important Dates

ActivityDate
Opening Submissions7 October 2026
Paper Submission Deadline7 January 2027
Notification of Acceptance7 March 2027
Camera Ready Submission31 March 2027
Symposium Dates12–14 May 2027

Submission Guidelines

Full papers (4–6 pages, IEEE double-column format) are invited. Submissions should present original research contributions, innovative applications, or case studies aligned with the symposium theme.

Accepted and presented papers will be submitted to IEEE Xplore subject to IEEE quality standards.

Submit your paper through EDAS:

https://edas.info/N35167